| <P>Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies has signed a Memorandum of Understanding (MoU) with Department of Science and Technology acting through MP State Electronics Development Corporation (MPSeDC). </P> <P>Paras Semiconductors and MPSeDC will integrate their respective expertise and resources to collaboratively facilitate the establishment of a greenfield advanced IC packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in Madhya Pradesh. </P> <P>Paras Semiconductors will set up a greenfield advanced IC packaging OSAT facility in Indore-Ujjain, Madhya Pradesh, with a proposed investment of approx. Rs. 6,200 crore. </P> <P>The facility will undertake advanced packaging operations including 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability.</P> |